STAR TAP℠ Engineering
  
				 
				Design, Manufacturing and Industrial Innovation
  
				
					
						 
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							Caterpillar's Distributed Virtual Reality System: Remote Collaboration in Vehicle Design 
							Caterpillar, Inc., USA; NCSA, USA; University of Houston, USA; University of Utah, USA; University of Illinois at Chicago, USA; Paralleldatorcentrum, Royal Institute of Technology, Sweden
  
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							Construction of Numerical Wind Tunnel Based on Design Procedure: From Aircraft Geometric Definition To Aircraft Flow Solutions 
							National Center for High-Performance Computing, Taiwan; National Cheng Kung University, Taiwan; National Chioa-Tung University, Taiwan National Center for High-Performance Computing, Taiwan; University of Minnesota, USA
  
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							CyberCAD: Internet Distributed Interactive Collaborative Design 
							see also: iGrid 2000 CyberCAD: Internet Distributed Interactive Collaborative Design 
							Temasek Polytechnic, Singapore; National University of Singapore, Singapore; Indiana University, USA
  
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							Distributed Virtual Reality Technology in Collaborative Product Design 
							National Center for Supercomputing Applications (in cooperation with Caterpillar, Inc.), USA; German National Research Center for Information Technology, (GMD), Germany
  
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							Industrial Mold Filling Simulation Using an Internationally Distributed Software Component Architecture 
							Indiana University, USA; Argonne National Laboratory, USA; Los Alamos National Laboratory, USA; Industrial Materials Institute, NRC, Quebec, Canada; Centre de Recherche en Calcul Appliqué (CERCA), Montréal, Canada
  
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							NCSA/Caterpillar Inc.-GMD Distributed Virtual Reality 
							National Center for Supercomputing Applications, Caterpillar Inc., and the German National Research Center for Information Technology
  
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							Parallel Computation of High-Speed Train Aerodynamics 
							National Center for High-Performance Computing, Taiwan; University of Minnesota, USA
  
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							Tele-Manufacturing via International High-Speed Network 
							Temasek Polytechnic, Singapore; National University of Singapore, Singapore; Indiana University, USA
  
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